Special Function  
1.Plating solution microcirculatory system .  There are two sets of microcellular foaming pipe and mute air pump in-side for making electroplating solution to form microcirculation. That can improve the quality of through-hole and electroplating.  
2.Reciprocating motion function of electroplating articles .It can control the electroplating rate by speed regulating.  

Technical parameters
Maximum board surface:340×340mm
Minimum aperture:0.4mm
Maximum thickness-diameter ratio:2.5：1
Output current:0～5A
Working rate:20～50mm/s
Standard Configuration:
Copper Sulfate  20L
黑孔液    500ML    
微蚀液    500ML    
整孔剂    100ML